The continuous development of the Internet of things has driven the expansion of the sensor market. With the increase of users, the use of sensors is also gradually improved. In the future, sensors around the world to meet the four major needs.
Due to the continuous development of the Internet of things and other connected devices, analysts predict that trillions of sensors will soon be used worldwide. But according to lux research agency report, before this forecast, parts manufacturers to satisfy many needs.
According to lux researcher Tiffany Huang report found that four demand around the sensor multiple applications at present is still not resolved. These four requirements are: power consumption, shape factor, sensitivity and cost.
Meeting these demands does not only mean the improvement of current sensor applications, but also implies the emergence of new applications, including sound source localization, precise motion tracking, and portable allergen detection.
It is reported that these requirements are particularly critical for the surge in sensors for several reasons.
Power consumption, for example, increases the cost of using the device and determines how long it takes to replace or recharge the battery. These two factors are always bothering consumers. Better control of power consumption will bring more possibilities for applications and make sensors and devices easier to use.
According to the report, the shape factor is also an important innovation area to broaden the deployment of sensors. Huang indicates that because the sensors are becoming increasingly complex in functionality, they may also be larger in shape and are not suitable for desired applications. This is also due to the progress of sensor usage, which requires the invention of suitable shape factor for applications.
In order to meet these requirements, engineers must carry out key innovations in new technologies and applications. According to Huang, the main innovations to meet these requirements include low power peripheral devices, energy harvesting, sensor packaging and new sensor types.
In these technologies, only the non sensor parts of the low-power peripheral devices can be produced in the factory, so it is the most readily available and easiest to implement.
